Process of molding an insert on a substrate

ABSTRACT

A molded structure formed in a mold having a space, the molded structure itself constituting a molding body when combined with an upper mold. The molded structure has a substrate which may be a carrier frame for an electrical connector. An insert which may be an elastomer is disposed on the substrate and formed in the space in the mold. A deformable (preferably elastic) molding seal is disposed directly on the substrate and under the elastomer, the molding seal preventing elastomer flash during molding. The molding seal may be a ridge surrounding the space of the mold in which the elastomer is formed. The substrate may also have a datum surface on which the mold locates, with the molding seal disposed in a plane which differs from the plane of the datum surface of the substrate. A process of molding the insert on the substrate is also provided.

This application is a divisional of U.S. patent application Ser. No.08/954,215, filed on Oct. 20, 1997, now U.S. Pat. No. 5,968,628.

TECHNICAL FIELD

The present invention relates generally to a molding process and, morespecifically, both to a molded electrical connector system and to aprocess for molding such a system substantially without producingundesirable flash.

BACKGROUND OF THE INVENTION

Injection molding is a well-known process for molding plastic parts. Oneapplication of injection molding is the formation of electricalconnectors. The newly emerging field of electrical connector productsrequires very tightly toleranced elastomers. As illustrated in FIG. 1,molded elastomers 10 used in electrical connectors are often vulcanizedto a carrier frame 12 to enhance the dimensional stability of theelastomer. The elastomer mold apparatus 100 has an upper mold 20, alower mold 22, and a mold cavity 24 defined between upper mold 20 andlower mold 22 and adapted to receive molded elastomer 10 and carrierframe 12. Upper mold 20 is typically designed to locate on a datumsurface 16 of carrier frame 12 to mold critical design elastomerfeatures to the smallest tolerance possible. Datum surface 16 is locatedon the top of steps 14, which are integrally formed as part of carrierframe 12, along datum line A—A.

Upper mold 20 has partitions 26 which form the space 28 which acceptsthe material of elastomer 10. The critical height dimension of elastomer10 is controlled with reference to datum surface 16. Upper mold 20 seatson datum surface 16, without compressing datum surface 16, to define theheight of elastomer 10. Partitions 26 must not contact carrier frame 12when upper mold 20 contacts datum surface 16; otherwise, undesirabledeformation of carrier frame 12 might occur. Upper mold 20 cannotsimultaneously contact two surfaces while still retaining sufficientcontrol over the height of elastomer 10. Consequently, a clearance 30exists between partitions 26 and carrier frame 12.

Flashing of the elastomer material may occur, at non-datum surfaces ofcarrier frame 12 such as the surfaces under partitions 26 of upper mold20, because partitions 26 do not “shut off” or locate on these non-datumsurfaces to seal the flow of elastomer during the injection moldingprocess. Clearance 30 created by the failure to seal the flow ofelastomer allows protrusions 40, known as “flash,” on the finishedarticle which must then be removed in a separate operation. Flash 40 isdifficult to remove from the finished molded part. Typically, flash 40is removed by a labor-intensive, manual process which adds cost to thepart and poses a risk of handling damage.

The problem of flash has been the subject of a number of correctiveattempts. Known attempts have been directed toward changes in the designof one or more mold components. Four such attempts are summarized below.

U.S. Pat. No. 5,597,523 issued to Sakai et al. discloses a moldingapparatus (10) and method in which a mold cavity gasket is deformed byseparately applied pressure to prevent flash formation. The moldingapparatus has upper and lower molds (12 and 14, respectively), both madeof metal, and a mold cavity (16) defined between the molds and adaptedto receive a molding material such as epoxy resin. Due to manufacturingtolerances, a clearance on the order of a few microns tends to remainbetween the upper and lower molds in the clamped position—particularlywhen the molds are unheated. If such a clearance exists, the moldingmaterial may flow out of the mold cavity and into the clearance. Whenthis occurs, undesirable flash will result.

To avoid flash, an annular recess (20) is defined adjacent to the moldcavity. A gasket (22) is fit in the recess and made of a deformablematerial such as lead. The gasket may also be made of synthetic resin,plastic, or other electrically insulative organic materials. A passage(24) is defined in the lower mold with one end of the passagecommunicating with the recess and the other end connected to a pump(26). A pressure medium such as silicon oil (25) fills the passage andexerts pressure on the gasket. This pressure deforms the gasketsufficiently to form a seal around the mold cavity. Although the sealprevents flash, the molding apparatus must be modified to create arecess and a passage in the mold, to accommodate a gasket, and toincorporate a pump and oil.

U.S. Pat. No. 5,543,159 issued to Iltgen discloses a flash-proofreaction-injection-molding (RIM) mold and a method of making the mold.RIM molds, like many molds, have at least two mold segments (14, 16)which, in a closed position, come together to define a mold cavity (8)and into which the reactants (2, 4) are injected. In a mold-openposition, the mold permits removal or ejection of the molded articlefrom the mold cavity. The mold segments each have a surface (20, 22)which faces the other mold segment. The surfaces have complementaryshapes and come together, in the mold-closed position, along a planeknown as a parting line (12) (thus, the parting line is analogous to thedatum surface 16 of FIG. 1).

There is usually some degree of mismatch between the mold segmentsurfaces. This mismatch results in the formation of small gaps betweenthe mating surfaces at the parting line, and particularly at the edge(24) of the parting line which is exposed to the mold cavity. When suchgaps occur at the edge of the parting line, the liquid mixture injectedinto the mold cavity can invade the parting line at its edge and produceprotrusions (i.e., flash) on the finished article which must then beremoved in a separate operation.

To address the flash problem, Iltgen provides an interlayer film (18′)of thermosetting resin between the mating mold surfaces. The resin fillsany small gaps between those surfaces to prevent intrusion of theparting line by any liquid reactants injected into the mold cavity. Thethermosetting resin adheres firmly to the surface (20) of one of themold segments. Preferably, the surface of the mold segment to which theresin film adheres is roughened to provide a multiplicity of anchoringsites for the film. Again, although Iltgen addresses the problem offlash, his solution requires modification of the RIM mold to include aroughened mold surface to which a thermosetting resin adheres.

U.S. Pat. No. 4,686,073 issued to Koller discloses a mold modificationsimilar to that of Iltgen. In his device for casting electric componentson a terminal carrier plate (4), Koller incorporates a silicon rubberlayer (2) which is cast on the surface of a flat, lower mold component(1). The silicon rubber layer is about 1 mm thick and contains recesses(3) which closely correspond to the dimensions of and accommodate theterminal carrier plate. A central mold component (5) is clamped downonto the lower mold component. The central mold component containschambers (7). A ridge (8) surrounds the port which defines the bottom ofeach chamber. These chambers match the electrical components which areto be cast. An upper mold component (9) has openings (10) through whichthe casting resin (11) passes.

When the central mold component is clamped down, the silicon rubberlayer is deformed by the ridges to seal the side surfaces (12) of theterminal carrier plate. Consequently, casting resin cannot penetrate theunderside (13) and the side surfaces of the terminal carrier plateduring casting. Although Koller does not address the problem of flash,he does propose a mold designed to prevent undesirable flow of castingresin. The mold design has a ridge and a cast-on silicon rubber layer.

U.S. Pat. No. 5,118,271 issued Baird et al. is directed to an apparatusfor encapsulating a semiconductor device. The mold of the apparatus hasa first cavity plate (17) and a second cavity plate (13). Asemiconductor lead frame (10) to be encapsulated is placed between thecavity plates. The mold is closed so that the clamping surfaces (23) ofthe cavity plates clamp directly onto the lead frame. Once the mold isclosed, an encapsulating material is introduced into the mold toencapsulate the lead frame. Elastic seals (19, 21) surround the outersurface of each cavity plate but do not cover either the clampingsurfaces or the inner surfaces of the cavity plates. After the mold isclosed, the elastic seals are pressurized and deform to compensate forany dimensional variations of the mold cavity plates or lead frame andcompletely seal the space between leads. Therefore, the elastic sealsprovide a supplementary seal to the clamping surfaces of the cavityplates and a primary seal in the space between leads of the encapsulatedlead frame. These seals prevent encapsulating material from escaping.

Like the Koller device, the apparatus of Baird et al. does not addressthe problem of flash. Baird et al. propose a mold designed to preventundesirable flow of encapsulating material. The mold design has elasticseals surrounding the outside surface of the mating mold cavity plates.

To overcome the shortcomings of prior attempts to address the problem offlash formation during the process of molding an elastomer to asubstrate such as an electrical connector, a new, deformable, elastomermolding seal for use in an electrical connector system is provided. Anobject of the present invention is to provide a molding seal. Anotherobject is to mold a plastic or metal substrate without producingundesirable flash, thereby eliminating the need for a costly processstep which removes elastomer flash. A related object is to eliminate aflash removal step while avoiding modifications to the mold. Anotherrelated object is to reduce the cost of manufacturing a molded part.

It is still another object of the present invention to improve thequality of the completed, molded part by eliminating the risk ofhandling damage which arises when the part is exposed to the processstep of flash removal. Yet another object of this invention is to extendthe life of the mold used to manufacture the molded part. An additionalobject is to achieve these advantages while still allowing the mold toaccurately register the height of the molded elastomer to any surface ofthe substrate desired by proper mold design. Finally, an object of thepresent invention is to meet the need for very tightly tolerancedelastomers demanded by the newly emerging field of electrical connectorproducts.

SUMMARY OF THE INVENTION

To achieve these and other objects, and in view of its purposes, thepresent invention provides a molded structure formed in a mold having aspace, the molded structure itself constituting a molding body whencombined with an upper mold. The molded structure has a substrate whichmay be a carrier frame for an electrical connector. An insert subject tothe formation of flash (such as an elastomer) is disposed on thesubstrate and formed in the space in the mold. A deformable molding sealis disposed directly on the substrate and under the insert, the moldingseal preventing flash during molding. The molding seal may be a ridgesurrounding the space of the mold in which the insert is formed. Thesubstrate may also have a datum surface on which the mold locates, withthe molding seal disposed in a plane which differs from the plane of thedatum surface of the substrate.

According to another aspect of the present invention, a process ofmolding a flashable insert on a substrate is provided. The processincludes the following steps. First, a mold is provided having an uppermold with a space, a lower mold, and a cavity disposed between the uppermold and the lower mold. A substrate, having a datum surface and adeformable molding seal, is positioned in the mold cavity. Either beforeor after the previous step, a flashable material is delivered to thespace of the upper mold. Finally, the mold is activated. This final stepcauses the upper mold to locate on the datum surface of the substrateand forms an insert on the substrate from the flashable material. Themolding seal prevents formation of flash. Therefore, the process of thepresent invention avoids a step of flash removal.

It is to be understood that both the foregoing general description andthe following detailed description are exemplary, but are notrestrictive, of the invention.

BRIEF DESCRIPTION OF THE DRAWING

The invention is best understood from the following detailed descriptionwhen read in connection with the accompanying drawing. It is emphasizedthat, according to common practice, the various features of the drawingare not to scale. On the contrary, the dimensions of the variousfeatures are arbitrarily expanded or reduced for clarity. Included inthe drawing are the following figures:

FIG. 1 is a cross-sectional view of the mold engaging the elastomer andcarrier frame without the sealing ridge of the present invention;

FIG. 2 is a top view of the carrier frame without the mold present; and

FIG. 3 is a cross-sectional view of the mold engaging the elastomer andcarrier frame with the sealing ridge according to the present invention.

DETAILED DESCRIPTION OF THE INVENTION

Referring now to the drawing, wherein like reference numerals refer tolike elements throughout, FIG. 2 is a top view of the substrate orcarrier frame 12 without the mold present. The goal of the moldingprocess is to attach an insert, which is subject to the formation offlash (i.e., the insert is a “flashable” material such as an elastomer,plastic, or aluminum), to the substrate. The flashable insert in theparticular example illustrated is elastomer 10. Shown in FIG. 2 is thegroove 32 in which elastomer 10 will be disposed in carrier frame 12.Carrier frame 12 may be made of plastic, although other suitablematerials can be used, and is typically rectangular with a length ofbetween 38 and 76 mm (1.5 and 3 inches). Again, however, other shapesand dimensions can be provided for carrier frame 12.

FIG. 3 is a cross-sectional view of upper mold 20 engaging elastomer 10and carrier frame 12. Both FIGS. 2 and 3 show that a deformable sealingridge 50 is provided directly on carrier frame 12. A spacer 60 (see FIG.2) may be provided between ridge 50 and elastomer 10 to preventdistortion of the critical dimensions of elastomer 10. Ridge 50 may beintegral with carrier frame 12 (i.e., ridge 50 and carrier frame 12 forma single, integrated, one-piece, monolithic component); alternatively,ridge 50 may be attached as a separate component to carrier frame 12 andsuch attachment may occur during the same molding process by whichelastomer 10 is molded to carrier frame 12.

Ridge 50 is a narrow, raised rib of material (preferably elastic,plastic, and hollow) which surrounds space 28 in which elastomer 10 isvulcanized and forms a molding seal. Carrier frame 12 itself is used asa molding insert in the molding process by which elastomer 10 isvulcanized to carrier frame 12. As upper mold 20 “shuts off” or locateson datum surface 16 of steps 14 of carrier frame 12, ridge 50 is crushedor compressed, then plastically deformed slightly, as the mold closes.More particularly, partition 26 of upper mold 20 engages ridge 50. Thecompression of ridge 50 provides a tight seal which prevents flashing ofthe material forming elastomer 10 beyond ridge 50. The elastomermaterial is allowed to flow, from space 28 of vulcanization, only toridge 50.

Space 28 in which elastomer 10 is formed may be a rectangular openingabout 6.4 mm (0.25 inches) wide and 25 to 50 mm (1 to 3 inches) long.Elastomer 10 is typically 0.9 to 1.8 mm (35 to 70 mils) high. Becausethe height of elastomer 10 is an important dimension, upper mold 20 mustaccurately locate on datum surface 16 of carrier frame 12 to controlcarefully the height of molded elastomer 10. Ridge 50 is disposed in aplane which differs from the plane in which datum surface 16 is located.As illustrated, the plane of ridge 50 is below the plane of datumsurface 16. Upper mold 20 seats on datum surface 16 without compressingdatum surface 16 or deforming carrier frame 12 away from datum surface16.

Ridge 50 forms a part of carrier frame 12. Thus, a part of one componentto be molded (namely, carrier frame 12) forms the seal which preventsflashing of another molded component (namely, the material of elastomer10). This aspect of the design of the present invention avoids the needto modify mold elements to prevent flashing.

Ridge 50 is between about 0.08 to 0.13 mm (3 to 5 mils) high and wide.Thus, ridge 50 preferably has a height which is less than one-tenth theheight of elastomer 10. The dimensions of ridge 50 are sufficientlysmall that ridge 50 has negligible effect on the structure and functionof the completed, molded part. That part includes carrier frame 12,ridge 50, and elastomer 10—all molded together. Specifically, elastomer10 is fully adhered (vulcanized) to carrier frame 12 within space 28encompassed by ridge 50.

The completed, molded part of the present invention is formed at asignificant cost savings: the elimination of elastomer flash avoidscostly flash removal. Moreover, the quality of the completed part isimproved by eliminating the risk of handling damage which arises whenthe part is exposed to the process step of flash removal. Theseadvantages are achieved while still allowing the mold to accuratelyregister the height of the molded elastomer to any surface of thecarrier frame desired by proper mold design. Thus, the present inventionmeets the need for very tightly toleranced elastomers demanded by thenewly emerging field of electrical connector products. The presentinvention can also be incorporated in many other productapplications—whether the applications be futuristic, emerging, existing,or mature—that require flash-free inserts with very close tolerancecontrol.

Upper mold 20 and lower mold 22 are made of a rigid material such astool steel and are machined to very tight tolerances. It is extremelydifficult to maintain machining tolerances at a level that will avoidmold flash from escaping through small spaces in the machine surfaces.As the mold wears, the spaces which permit flash tend to become larger.The solution offered by the present invention, which inhibits flashformation even as the spaces expand, functions to extend the life of themold.

Although illustrated and described herein with reference to certainspecific embodiments, the present invention is nevertheless not intendedto be limited to the details shown. Rather, various modifications may bemade in the details within the scope and range of equivalents of theclaims and without departing from the spirit of the invention.

What is claimed:
 1. A process of molding an insert on a substratecomprising the steps of: (a) providing a mold having an upper mold witha space, a lower mold, and a cavity disposed between the upper mold andthe lower mold; (b) positioning a substrate, having a datum surface onwhich the upper mold locates; (c) positioning an elastic, deformablemolding seal in the mold cavity so as to be positioned to outwardlysurround an outer radial edge of an insert to be formed in the mold; (d)delivering an insert material to the space of the upper mold; and (e)activating the mold, causing the upper mold to locate on the datumsurface of the substrate and forming an insert on the substrate from theinsert material, the molding seal preventing formation of insert flash.2. The process of claim 1 avoiding a step of insert flash removal. 3.The process of claim 1 wherein the step (e) of activating the moldcompresses, then plastically deforms slightly, the molding seal, therebyproviding a tight seal around the space of the mold.
 4. The process ofclaim 1 wherein the substrate is a carrier frame and the molding seal isa ridge.
 5. The process of claim 4 wherein the ridge is integral withthe carrier frame and both the ridge and the carrier frame are plastic.6. The process of claim 1 wherein the molding seal is hollow.
 7. Theprocess of claim 1 further comprising the step of positioning a spacerbetween the molding seal and the insert material.